Basic Principles of Polymer Thick Film Flexible Circuits


Reading time ( words)

Polymer thick film (PTF) technologies have been used to manufacture printed circuits for decades. In fact, some of the very first circuits ever produced in volume were made by printing conductive inks patterned on an insulating substrate using a stencil. While the versatile nature of the materials used and the simplicity of the manufacturing process have made possible its continued use for more than six decades. In more recent decades, the technology has seen extensive use in the manufacture of inexpensive, polyester film-based membrane switches for electronic devices of every imaginable type, from hand-held calculators and computer keyboards to household appliances including microwave ovens and washers and dryers and beyond.

Polymer thick film circuits are similar in many ways to their rigid and flexible counterparts; however, because of the materials and processes, they have their own very specific design rules. Because most PTF processing is most commonly based on screen printing technology, the limits of design are intrinsically linked to the printed ink’s processing considerations and limitations. For example, there are the unique processing properties for conductive and resistive as well as insulating inks in terms of their thixotropy, which influence their printability. There is also the important consideration of the final values for the conductivity and/or resistivity of the ink used when cured. In addition, there are also the limits of the screen printing materials and the processes used.

Traditional screen printing methods are typically limited to the production of relatively course features (e.g., 250 µm). However, very fine-featured screen printed circuit technology has been reported down to ranges closer to 125 µm. For the foreseeable future, screen printing will remain an important technology for the manufacture of PTF circuits, both rigid and flexible. That said, inkjet printing is well positioned to augment time honored screen print methods. It also opens the door to realizing the possibility of producing circuits economically at a run unit of one, which has been one of the ideals of manufacturing. 

Read the full article here.


Editor's Note: This article originally appeared in the June 2014 issue of The PCB Magazine.

Share




Suggested Items

A Promising Future for Automation

03/21/2023 | Christopher Bonsell, Chemcut
This year, I had the great opportunity to come to IPC APEX EXPO in San Diego as a contributing member in Chemcut’s booth. Being an exhibitor is always interesting because you never know what you will learn or who you will meet. Truly, it seems that every IPC APEX EXPO is an eye-opening experience. This was the second show I attended, and last year I was amazed to see how in-depth and interconnected the electronics industry is. Seeing how many different companies contribute to manufacturing today’s core technology never fails to impress me.

IPC APEX EXPO 2023 Special Session: Advanced Packaging

03/13/2023 | Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.

EIPC Winter Conference 2023: Day 1 Review

02/27/2023 | Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.