EMS Discovers Mature IC Technologies


Reading time ( words)

Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers.

For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly a lot of OEMs are using them in their advanced products; others are quickly coming on board. But I’m not talking about those.

The ones I’m talking about are some more recent ones that EMS companies have recently discovered, while PCB technology has been evolving at such a rapid pace.
 
The technologies coming to our attention are:
  • Wire bonding;
  • Ribbon bonding;
  • Die bonding;
  • Extraordinarily fine-pitch 0.25-mm pitch BGAs; 
  • Buried resistance/buried capacitance; and
  • Chip on board or CoB.

Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine. 

Share




Suggested Items

How Smart Are You?

04/25/2022 | Michael Ford, Aegis Software Corp.
The standard IQ test has been established for many years now. Though the content within these tests has been cleverly and carefully put together, there are different kinds of “smarts” among people. It is likely that those who are putting together IQ tests will favor the kinds of “smarts” that they themselves have. Humans are very complex, however. Everyone is different, with natural skills and abilities in a multitude of disciplines: technical, artistic, social, and others. Put us all together as a society, and we make a pretty good team, at least when we all work together and support each other.

Factors Affecting Quality of Solder Joints in Multi-Busbar Interconnection

08/17/2021 | Narahari S. Pujari, MacDermid Alpha Electronics Solutions
Tabbing and stringing is the dominant method in the market for making crystalline silicon (c-Si) solar cell modules. Soldering ribbons are used as an interconnection medium in this process on the four or five busbars of the front- and back-side metallization.

Top 10 Most-Read SMT Articles of 2020

12/31/2020 | I-Connect007
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.



Copyright © 2022 I-Connect007. All rights reserved.