-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Graphite-based Direct Metallization for Fabrication of Complex Interconnect Designs
July 16, 2014 |Estimated reading time: 1 minute
Introduction
The technology trends are unmistakable, such as the need to move into higher functionality while reducing footprint of the PWB substrate. In turn, this triggers circuit designs with smaller vias, blind, buried and stacked vias, as well as any-layer technology. In addition, there is a call-out for more flexible and rigid-flexible printed circuit boards. Complicating matters for the fabricator is the proliferation of material sets designed to support the low-loss, high-frequency market segment. With all of these changes, along with heightened emphasis on end-product reliability and productivity, metallization performance is under the highest scrutiny.
Direct Metallization
Direct metallization of boards is a predominant process in flex circuit and microvia manufacture. This conveyorized process is fast and efficient. However, in North America, direct metallization is not as common as in overseas marketplaces, most likely reflecting the higher percentage of flex and microvia in the production mix. Regardless, direct metallization processes (most) offer lower consumption of resources over conventional electroless copper. This includes reduced rinse water and waste treatment concerns, lower power consumption as well as fewer chemical processes to maintain. For most direct metallization systems including graphite based processes, the equipment footprint is quite small when compared to a conventional electroless copper line of equal productivity. This is indeed an advantage with respect to capex utilization and return on assets.
Read the full article here.
Editor's Note: This article originally appeared in the May 2014 issue of The PCB Magazine.
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: