Reading time ( words)
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
To watch the interview, click here.
Share
Suggested Items
EIPC Review: Ultra-high-density Interconnects, Thin-film Resistor Materials
05/10/2023 |
Pete Starkey, I-Connect007
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.
Chemical Legislation and Restrictions on Solder Masks
04/27/2023 |
Chris Wall, technical director, Electra Polymers
Ever since liquid photoimageable solder masks (LPISMs) were introduced, their UV exposure speed has been a key factor in their performance. The LPISM is coated onto the PCB, dried, and then selectively exposed with UV light via a phototool, or more recently, via direct imaging using LED or lasers. The exposed areas polymerise and become insoluble in the developing solution. The polymerisation is initiated by one or more chemicals called photoinitiators, which are components of the LPISM.
EIPC Winter Conference 2023: Day 1 Review
02/27/2023 |
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
