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Mark Goodwin, Ventec International Group CEO EMEA and USA, speaks with I-Connect007 Technical Editor Pete Starkey on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
To watch the interview, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Andy Shaughnessy, Design007 Magazine
At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.
Andy Shaughnessy, I-Connect007
We want your input! PCB fabricators have been utilizing benchmarks for decades, comparing metrics for everything from manufacturing best practices to competitors’ products and services. Now, we have access to more manufacturing data than ever before, and companies can conduct benchmarking at a granular level.
Nolan Johnson, I-Connect007
The adage about spring weather in Northern temperate climates is, “April showers bring May flowers.” This is, of course, on the heels of March, when the weather comes “In like a lion, out like a lamb.” The suggestion for March is that whatever way the month starts, it will end just the opposite. But we’re in the first week of April, where things are expected to settle into a steady state of preparation for an abundance just over the horizon. Sound a bit like our business climate right now, doesn’t it?