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GPV’s Q1 2024 Interim Financial Report Shows Strong Navigation in Uncertain Times

05/01/2024 | GPV
Danish-based GPV recorded an expected drop in sales to DKK 2.3 billion for the first quarter of 2024. The decline also affected the operating profit, which was DKK 155 million compared to DKK 179 million in the same quarter last year, although the EBITDA margin was maintained. In general, demand has been softer in 2024, but GPV continues to invest for the long-term and expects the trend to turn in the second half of 2024.

Danfoss Awarded Scanfil

05/01/2024 | Scanfil
Scanfil received an award from Danfoss in regards of delivery performance, quality, and customer service. We are honored to receive this award. 

Celestica Announces Q1 2024 Financial Results

05/01/2024 | Celestica
Celestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world's most innovative companies, today announced financial results for the quarter ended March 31, 2024 (Q1 2024).

The Knowledge Base: A CM’s Perspective on Box Build Practices

04/30/2024 | Mike Konrad -- Column: The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.

TTM’s High Tech Expansion and Industry Innovation

04/30/2024 | Marcy LaRont, PCB007 Magazine
Tom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
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